cost effective ZM-R6810 semi auto BGA rework machi

specifications and technical parameters: 1Total Power6750W2Top heater1200W3Bottom heater2nd heater 1200W,3rd IR heater 4200W4powerAC220V±10% 50/60Hz5Dimensions900*680*900 mm6Positioning V-groove, PCB support can be adjusted in any direction and with external universal fixture 7TemperaturecontrolK-type thermocouple (Closed Loop), heating independently, temperature precision within ±2 degree8PCB sizeMax 390*450mm Min 125*20 mm9ElectricalmaterialsServo Drive( Panasonic)+Touch screen( Taiwan)+Panasonic PLC+Heating plate(Germany)10Cameramagnification10x-100x11Optical systemJapanese original high-definition CCD color imaging system12BGA chip1×1-80×80mm13Touch screen7.0 inch, Resolution 640X480, Panel Visa touch screen, external USB interface14External temperature sensor four 15Work ModePower drive16Placement Accuracy X, Y axis and the R angle with micrometer adjust, accuracy within ± 0.01MM 17Net weight85kgOthers: Model No.: ZM-R6810 Machine Dimension: L900*W680*H900 mmPower: AC/220V Packing: Standard Packing 112*109*97CM N. Weight: 85KG G. Weight: 160KG Guarantee: 1 year, free technical support after guarantee. Delivery time:2 weeks after PO. Delivery Port: Shenzhen, Hong Kong For: laptop/desktop motherboards, Xbox, PSP, mobiles, router, VGA card etc. Chip Package: BGA/CSP/DFN/QFN/QFP/LGA, Socket etc. Main Accessories: Hot air nozzle 6pcsTemp. Sensor 1pcsPCB fixture 6pcsExtra IR heater 1pcsExtra heating wire 2pcsMonitor 1pcsInstruction book 1pcsTool box 1pcs……..